The invention provides a method for electroforming mask positioning (Mark) preparation method comprises the following steps: the image file in the production of Mark design for opening for imaging through exposure mode, dry film after development at the Mark point to form the corresponding dry film; for the first time in the core after developing electroforming on the formation of thin coating, and then remove the photosensitive film; wash the position of Mark, keep the graphics area opening film, a through hole is formed in the Mark position; back into the plating bath for second times to remove the required thickness of electroforming, fabricated electroforming plate, forming the Mark point in the blind hole; the Mark point add Mark vinyl, vinyl does not exceed the height of electroforming board, such as casting Mark fabricated by electroforming. The invention can produce high contrast Mark, improve the Mark point recognition; Mark wear production, not easy to be cleaned; in addition, the invention can make the high position accuracy of Mark points, Mark points at the same time to solve the problem of insufficient blackness. ?
【技术实现步骤摘要】
【技术保护点】
一种电铸掩模板定位点的制备方法,其特征在于,包括如下步骤:在制作图像文件时将Mark点设计为开口,通过曝光的方式进行成像,干膜显影后在Mark点处形成相应干膜;在显影后的芯模上进行第一次电铸,制作厚度为0.04?0.06mm的薄镀层,然后取出;将Mark点位置的感光膜洗掉,保留图形区域开口干膜,在Mark点位置形成一个通孔;重新放进电镀槽中进行第二次电铸到要求厚度,该厚度要大于薄镀层的厚度,在电铸板制作成功后取出,形成Mark点盲孔;Mark点深度L为第二次电铸厚度与第一次电铸厚度之差;而后在Mark点位置添堵Mark黑胶,黑胶高度不超过电铸板面,这样电铸用的Mark点就通过电铸制作成功。
【技术特征摘要】
【专利技术属性】
技术研发人员:魏志凌,高小平,潘世珎,赵录军,
申请(专利权)人:昆山允升吉光电科技有限公司,
类型:发明
国别省市:
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