氮化物半导体元件及其制造方法与所应用的封装结构技术

技术编号:21312771 阅读:22 留言:0更新日期:2019-06-12 12:20
一种氮化物半导体元件(100),其包括P型氮化物半导体(101)、N型氮化物半导体(102)、氮化物半导体量子井发光结构(103)、基板(104)以及缓冲层(105)。氮化物半导体量子井发光结构(103)位于P型氮化物半导体(101)以及N型氮化物半导体(102)之间,且包括多个井层(103A)以及多个阻挡层(103B)。各个井层(103A)以及各个阻挡层(103B)彼此交错配置。多个阻挡层(103B)包括配置于最接近P型氮化物半导体位置(101)的第一阻挡层(103B1)、配置于最接近N型氮化物半导体(102)位置的第二阻挡层(103B2)以及多个第三阻挡层(103B3)。第一阻挡层(103B1)的厚度小于100埃。各个第三阻挡层(103B1)位于相邻的两个井层(103A)之间。缓冲层(105)位于N型氮化物半导体(102)以及基板(104)之间。

Nitride Semiconductor Components and Their Manufacturing Methods and Packaging Structures Applied

A nitride semiconductor element (100) comprises a P-type nitride semiconductor (101), a N-type nitride semiconductor (102), a nitride semiconductor quantum well luminescence structure (103), a substrate (104) and a buffer layer (105). The nitride semiconductor quantum well luminescence structure (103) is located between the P-type nitride semiconductor (101) and the N-type nitride semiconductor (102), and includes multiple well layers (103A) and multiple barrier layers (103B). Each well layer (103A) and each barrier layer (103B) are interlaced with each other. A plurality of barrier layers (103B) include a first barrier layer (103B1) disposed nearest to the position of P-type nitride semiconductor (101), a second barrier layer (103B2) disposed nearest to the position of N-type nitride semiconductor (102) and a plurality of third barrier layers (103B3). The thickness of the first barrier layer (103B1) is less than 100 A. Each third barrier layer (103B1) is located between two adjacent well layers (103A). The buffer layer (105) is located between the N-type nitride semiconductor (102) and the substrate (104).

【技术实现步骤摘要】
【国外来华专利技术】PCT国内申请,说明书已公开。

【技术保护点】
PCT国内申请,权利要求书已公开。

【技术特征摘要】
【国外来华专利技术】2016.08....

【专利技术属性】
技术研发人员:林宏诚陈宗源
申请(专利权)人:亿光电子工业股份有限公司
类型:发明
国别省市:中国台湾,71

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