The utility model discloses a spring needle module transfer structure and a semiconductor device, which comprises an upper cover with an upper connecting hole; The lower cover is connected with the upper cover through a support column, and the lower cover is provided with a lower connecting hole; The upper end of the conductive sleeve is inserted with the upper connecting hole, and the lower end is inserted with the lower connecting hole. The upper end of the conductive sleeve is provided with an upper holding cavity, and the lower end of the conductive sleeve is provided with a lower holding cavity; The needle tube of the upper pin is inserted into the upper holding cavity; The needle tube of the lower pin is inserted into the lower holding cavity. The utility model uses a conductive sleeve to replace the wire rod, and by setting an upper holding cavity at the upper end of the conductive sleeve to connect with the needle tube of the upper pin needle, and setting a lower holding cavity at the lower end of the conductive sleeve to connect with the needle tube of the lower pin needle, the stability of the connection is guaranteed. When the pin needle is damaged, the damaged pin needle can be directly pulled out for maintenance and replacement without manual welding, which can improve the processing accuracy and shorten the production cycle. Shorten the production cycle. Shorten the production cycle< br/>
【技术实现步骤摘要】
弹簧针模组转接结构及半导体设备
[0001]本技术涉及电子测试
,特别涉及一种弹簧针模组转接结构及半导体设备。
技术介绍
[0002]在电子测试中,弹簧针模组是一种常见的测试信号转接结构,现有的弹簧针模组大多采用Pin针与线材直连,配合PCB板进行信号输出,Pin针与线材的连接处采用焊接方式,并进行灌胶处理,这种结构存在以下弊端:
[0003]当有Pin针损坏时,无法进行维修;同时,由于尺寸小,只能采用人工焊接,导致精度偏差大且生产周期长。因此,有必要提供一种新的弹簧针模组转接结构来解决上述问题。
技术实现思路
[0004]本技术要解决的技术问题是提供一种用导电套管取代线材、方便维修、精度高的弹簧针模组转接结构。
[0005]为了解决上述问题,本技术提供了一种弹簧针模组转接结构,其包括:
[0006]上盖,所述上盖上设有上连接孔;
[0007]下盖,所述下盖通过支撑柱与所述上盖连接,所述下盖上设有下连接孔;
[0008]导电套管,所述导电套管的上端与所述上连接孔插接,下端与所述下连接孔插接,所述导电套管的上端设有上容纳腔,所述导电套管的下端设有下容纳腔;
[0009]上Pin针,所述上Pin针的针套与所述上容纳腔插接;
[0010]下Pin针,所述下Pin针的针套与所述下容纳腔插接。
[0011]作为本技术的进一步改进,还包括防撞板,所述防撞板通过弹性件与所述上盖连接,所述防撞板上设有供所述上Pin针通过的通孔。
[0012]作 ...
【技术保护点】
【技术特征摘要】
1.一种弹簧针模组转接结构,其特征在于,包括:上盖,所述上盖上设有上连接孔;下盖,所述下盖通过支撑柱与所述上盖连接,所述下盖上设有下连接孔;导电套管,所述导电套管的上端与所述上连接孔插接,下端与所述下连接孔插接,所述导电套管的上端设有上容纳腔,所述导电套管的下端设有下容纳腔;上Pin针,所述上Pin针的针管与所述上容纳腔插接;下Pin针,所述下Pin针的针管与所述下容纳腔插接。2.如权利要求1所述的弹簧针模组转接结构,其特征在于,还包括防撞板,所述防撞板通过弹性件与所述上盖连接,所述防撞板上设有供所述上Pin针通过的通孔。3.如权利要求2所述的弹簧针模组转接结构,其特征在于,初始状态下,所述上Pin针的针头位于所述通孔内。4.如权利要求2所述的弹簧针模组转接结构,其特征在于,...
【专利技术属性】
技术研发人员:魏津,熊慧敏,徐润生,
申请(专利权)人:绅克半导体科技苏州有限公司,
类型:新型
国别省市:
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