The invention relates to a hole filling process for through-hole of circuit board, the steps of which are: cutting; drilling; copper sinking: a conductive copper layer is deposited on the hole wall insulation layer; copper plating: the hole is filled with copper plating, and the copper layer on the surface of the base plate is thickened; grinding: the surface copper thickness is thinned and leveled; etching circuit: exposure, development, etching, and film removal. The manufacturing process of the invention is simple and easy to operate, which not only improves the wiring density and is convenient for wiring, but also makes the copper surface smooth without particles after grinding after the through-hole is filled, and the circuit yield is high, which is conducive to the bonding process such as welding and wiring on the pad surface, and because the cross-sectional surface of the copper layer in the hole is increased, it is not only able to carry large current, but also more conducive to heat dissipation; moreover, because the through-hole is After the hole filling and grinding, the surface can be wired, so more through holes can be designed for hole filling, which increases the copper area in the circuit board. Before changing the material, the XY direction increases the strength of the board, and the Z direction increases the compression resistance of the circuit board, which is conducive to the packaging of the circuit board.
【技术实现步骤摘要】
一种线路板通孔的填孔工艺
本专利技术涉及一种电路板制作
,尤其涉及一种线路板通孔的填孔工艺。
技术介绍
随着技术的不断进步,对电子产品的功能要求越来越高,为满足一些高端电子产品的需求,需要将电路板制作的更轻薄更精密化,尤其是当电路板本身承载的功率更小时,对PCB板上的导通孔和线路要求更高,线路、导通孔以及焊盘都力求精简。目前导通孔的填孔工艺如图1所示,步骤为:开料→钻孔→沉铜(孔壁绝缘层沉积一层导电的铜层)→镀铜(孔内壁和表面铜层加厚,达到客户要求)→蚀刻线路(做曝光、显影、蚀刻、去膜)。但是常规工艺存在一下缺陷:一、通孔表面无法设计线路,如走线、焊盘等,无法进一步提升产品的布线密度;二、孔内铜厚有限,无法承载较大的电流,散热性不佳;三、镀铜后表面有些铜颗粒,影响线路的良率,会产生开路好短路不良(通孔无法研磨,因为在研磨时铜的粉屑会掉到通孔内,导致孔堵不良);四、因通孔表面无法设计走线,所以通孔的位置要避开其他线路处,对设计有局限性。经查,现有专利号为201510716309.5的中国专利《一种PCB板埋孔的填孔方法》,在PCB板的基板上的导通孔内壁面上形成铜膜,导通孔上具有孔径小于其它部分的孔径的尖端位置;从导通孔的与尖端位置相对设置的开口处向尖端位置处喷电镀液;在尖端位置处依次通负脉冲直流电和正脉冲直流电,并且通负脉冲直流电的时间大于通正脉冲直流电的时间,以在导通孔内填满镀铜形成埋孔。该导通孔采用尖端结构,而且只在通孔内镀铜,虽然能提高电气性能,但是散热性能不好,且不能适用于传统的圆柱形导通 ...
【技术保护点】
1.一种线路板通孔的填孔工艺,其特征在于包括以下步骤:/n1)基板开料;/n2)钻出导通孔;/n3)沉铜:孔壁绝缘层沉积一层导电的铜层;/n4)镀铜:使得孔内填满镀铜,基板表面铜层加厚;/n5)研磨:面铜厚度减薄、整平;/n6)最后蚀刻线路:曝光、显影、蚀刻、去膜。/n
【技术特征摘要】 【专利技术属性】
1.一种线路板通孔的填孔工艺,其特征在于包括以下步骤:
1)基板开料;
2)钻出导通孔;
3)沉铜:孔壁绝缘层沉积一层导电的铜层;
4)镀铜:使得孔内填满镀铜,基板表面铜层加厚;
5)研磨:面铜厚度减薄、整平;
6)最后蚀刻线路:曝光、显影、蚀刻、去膜。
技术研发人员:张成立,徐光龙,王强,李东海,茆昊奇,黄礼树,
申请(专利权)人:宁波华远电子科技有限公司,
类型:发明
国别省市:浙江;33
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