基于一体封装工艺的摄像模组和阵列摄像模组制造技术

一种基于一体封装工艺的摄像模组和阵列摄像模组，摄像模组包括：线路板(212)，一体基座(211)，感光元件(220)，镜头(230)，滤光元件镜座(240)和安装于滤光元件镜座的滤光元件(250)；滤光元件镜座(240)被支撑于一体基座的至少一部分顶表面(2113)，并且滤光元件镜座(240)配合一体基座(211)并形成一光窗(2111)，为感光元件(220)提供光线通路；其中一体基座(211)一体封装于线路板(212)和感光元件(220)并包埋感光元件连接件(221)，线路板连接件(222)和连接线(223)，并使一体基座(211)的顶表面(2113)的内边缘与摄像模组的光轴之间的距离不大于线路板连接件(222)的外边缘与摄像模组的光轴之间的距离，以使一体基座(211)的顶表面(2113)提供更大面积的安装面。

Camera Module and Array Camera Module Based on Integrated Packaging Technology

A camera module and an array camera module based on an integrated packaging process include a circuit board (212), an integrated pedestal (211), a photosensitive element (220), a lens (230), a filter element pedestal (240) and a filter element (250) mounted on the filter element pedestal; a filter element pedestal (240) is supported on at least part of the top surface of the integrated pedestal (2113), and a filter element pedestal (240). A light window (2111) is formed with an integrated base (211) to provide a light path for a photosensitive element (220); one integrated base (211) is encapsulated in a circuit board (212) and a photosensitive element (220) and embedded in a photosensitive element connector (221), a circuit board connector (222) and a connecting line (223), and the distance between the inner edge of the top surface (2113) of the integrated base (2113) and the optical axis of the camera module is not greater than that of the line. The distance between the outer edge of the road plate connector (222) and the optical axis of the camera module enables the top surface (2113) of the integrated base (211) to provide a larger mounting surface.

【技术实现步骤摘要】
【国外来华专利技术】PCT国内申请，说明书已公开。

【技术保护点】
PCT国内申请，权利要求书已公开。

【技术特征摘要】
【国外来华专利技术】2016.08....

【专利技术属性】
技术研发人员：王明珠，赵波杰，陈振宇，郭楠，田中武彦，
申请(专利权)人：宁波舜宇光电信息有限公司，
类型：发明
国别省市：浙江,33