The utility model provides an automatic feeding device for solder paste, which belongs to the field of feeding equipment. The utility model comprises a frame, on which a feeding tank body is fixed, two conical feeding tanks are arranged at the bottom of the feeding tank body, a centrifugal motor is arranged between the two vertebral bodies, a centrifugal mixing chamber is arranged in the feeding tank body, and a plurality of through holes are arranged at the side of the centrifugal mixing chamber. The centrifugal motor is connected to the centrifugal mixing chamber through a rotating shaft, and the lower parts of the two conical feeding tanks are equal. A storage tank is provided, and the storage tank is connected with a conical feeding tank. A valve is arranged between the conical feeding tank and the storage tank. A weighing device and an outlet are arranged at the bottom of the storage tank. An electromagnetic valve is arranged at the outlet, and the outlet is connected with the discharge pump through a pipeline. Compared with the prior art, the utility model has strong autonomous selectivity, is suitable for the place where the material is made according to the subjective will, and has the characteristics of simple structure, strong autonomous selectivity and high degree of automation.
【技术实现步骤摘要】
焊锡膏自动投料装置
本技术属于投料设备领域,具体而言,涉及一种焊锡膏自动投料装置。
技术介绍
焊锡膏也叫锡膏,英文名solderpaste,灰色膏体。焊锡膏是伴随着SMT应运而生的一种新型焊接材料,是由焊锡粉、助焊剂以及其它的表面活性剂、触变剂等加以混合,形成的膏状混合物。主要用于SMT行业PCB表面电阻、电容、IC等电子元器件的焊接。现有的焊锡膏投料装置通常是根据需要采用不同量的投料口进行投料,投料口常常设置多个,每个投料口的投料量通常是固定不变,灵活性较低,无法适用于需要根据主观意愿进行投料的场所,且现有的焊锡膏投料装置结构复杂,自动化程度低。鉴于此,本技术提供一种焊锡膏自动投料装置。
技术实现思路
为解决上述问题,本技术提供一种焊锡膏自动投料装置,其投料灵活,结构简单,自主选择性强。本技术通过下述技术方案实现:焊锡膏自动投料装置,包括机架,所述机架上固定有投料罐体,所述投料罐体的底部设有两个锥形投料槽,两所述锥形投料槽之间设有离心电机,所述投料罐体内设有离心搅拌室,该离心搅拌室的侧方设置有多个通孔,所述离心电机通过转轴连接所述离心搅拌室,两所述锥形投料槽的下方均设置 ...
【技术保护点】
1.焊锡膏自动投料装置,其特征在于:包括机架,所述机架上固定有投料罐体,所述投料罐体的底部设有两个锥形投料槽,两所述锥形投料槽之间设有离心电机,所述投料罐体内设有离心搅拌室,该离心搅拌室的侧方设置有多个通孔,所述离心电机通过转轴连接所述离心搅拌室,两所述锥形投料槽的下方均设置有储料罐,该储料罐和锥形投料槽连通,所述锥形投料槽和储料罐之间设置有阀门,所述储料罐的底部设置有称重装置和出料口,该出料口处设置有电磁阀,所述出料口通过管道连接出料泵。
【技术特征摘要】
1.焊锡膏自动投料装置,其特征在于:包括机架,所述机架上固定有投料罐体,所述投料罐体的底部设有两个锥形投料槽,两所述锥形投料槽之间设有离心电机,所述投料罐体内设有离心搅拌室,该离心搅拌室的侧方设置有多个通孔,所述离心电机通过转轴连接所述离心搅拌室,两所述锥形投料槽的下方均设置有储料罐,该储料罐和锥形投料槽连通,所述锥形投料槽和储料罐之间设置有阀门,所述储料罐的底部设置有称重装置和出料口,该出料口处设置有电磁阀,所述出料口通过管道连接出料泵。2...
【专利技术属性】
技术研发人员:赵跃,
申请(专利权)人:广州市铠特电子材料有限公司,
类型:新型
国别省市:广东,44
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