The invention relates to a light source module and a radiating block, wherein, the light source module comprises a radiating block, a light emitting diode chip and a fan module. The heat sink has a surface. The light emitting diode wafer is arranged on the surface of the radiating block. The fan module and the light emitting diode wafer are respectively positioned on the opposite sides of the radiating block. The fan module has an opening, a blade and a blade around the opening of the baffle, which is set on the opening, and is adapted to generate a flow of air, airflow opening along a flow direction of flow to dissipate the heat of the heat sinks, the baffle plate and the flow direction of the airflow towards the opposite direction. The light source module of the invention has better heat radiating efficiency, and heat dissipation block of the invention is adapted for carrying a light emitting diode chip and having a plurality of vent holes, can increase the overall cooling capacity, and can improve the reliability of welding.
【技术实现步骤摘要】
本发 涉及一种光源模组以及散热元件,尤其涉及一种采用发光二极管晶片作为发光元件的光源模组与散热块。
技术介绍
随着半导体科技的进步,现今的发光二极管(light emitting diode,简称为 LED)可发出高亮度的光线,并且具有省电、体积小、低电压驱动等优点,因此发光二极管已广泛地应用于各种照明设备中。一般而言,当发光二极管发出高亮度的光线时,会产生大量的热能。倘若热能无法逸散而不断地堆积在发光二极管内,发光二极管的温度会持续地上升。如此一来,发光二极管可能会因为过热而导致亮度衰减及使用寿命缩短,严重者甚至造成永久性的损坏。因此, 现今采用发光二极管的照明设备都会配置散热块(heat sink)以对发光二极管进行散热。然而,在现有的发光二极管光源模组中,发光二极管是配置于电路板上,而载有发光二极管的电路板再配置于散热块上。通过风扇所产生的气流对散热块进行散热,便能够将发光二极管的热能带走。然而,由于一般电路板上会有绝缘层以使不同的线路层达到绝缘的效果,但绝缘层是热的不良导体,这会对发光二极管的热量通过电路板传导至散热块的速率造成不良的影响,进而导致发光二 ...
【技术保护点】
1.一种光源模组,其特征在于,包括:一散热块,具有一表面;一发光二极管晶片,配置于所述散热块的所述表面上;以及一风扇模组,所述风扇模组与所述发光二极管晶片分别位于所述散热块的相对两侧,所述风扇模组具有一开口、一叶片与一环绕所述开口的挡板,其中所述叶片配置于所述开口中,且适于产生一气流,所述开口中的所述气流沿着一流动方向流动,以对所述散热块进行散热,所述挡板阻挡所述气流朝向与所述流动方向相反的方向流动。
【技术特征摘要】
【专利技术属性】
技术研发人员:刘玉茹,陈奕宏,
申请(专利权)人:亿光电子工业股份有限公司,
类型:发明
国别省市:71[]
还没有人留言评论。发表了对其他浏览者有用的留言会获得科技券。