The present invention provides glass ceramics such that the glass ceramics can adapt LSI lithography and semiconductor equipment components such as the next generation mask, optical reflector, wafer and mask platform platform and a variety of precision components using this glass ceramic ultra low thermal expansion performance and ultra flat surface. The invention of the glass ceramics in 0 - 50 DEG C temperature range the average linear thermal expansion coefficient of 0 + 0.2 * 10 = 7 / - / C, the maximum value of L / L and the minimum value of the difference between the 10 * 10 = 7, or lower, and with a total of 86 89 mass% SiO: 2, Al: 2 O: 3 and P: 2 O: 5.
【技术实现步骤摘要】
【技术保护点】
玻璃陶瓷，其在０－５０℃的温度范围内的平均线性热膨胀系数为０．０±０．２×１０↑［－７］／℃，ΔＬ／Ｌ的最大值与最小值之间的差为１０×１０↑［－７］或更低，并含总量为８６．０－８９．０质量％的ＳｉＯ↓［２］、Ａｌ↓［２］Ｏ↓［３］和Ｐ↓［２］Ｏ↓［５］。
【技术特征摘要】
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