The invention belongs to the molding technology of resin based composite material, and relates to a method for improving Z Pin reinforced resin composite quality. The Pin needle on the surface of the protruding composite material is removed after the method is solidified and formed, so as to avoid the risk that the tool does not damage the surface of the uncured laminated surface before being removed, and the surface quality of the formed part is high. The Pin needle implantation process and subsequent molding process, the porous plate in the composite process to increase the blank, to avoid forming the external pressure only acts on the Pin pin, it is difficult to effectively transfer the risk to the Pin stack between the needle and the needle Pin, significantly improve the forming quality of composite parts. This method is applicable to a wide range of materials to be enhanced, not only suitable for Z Pin enhanced dry fabric, but also suitable for Z reinforced Pin prepreg blank, also suitable for foam sandwich composite material blank; structure form, is not only suitable for Z Pin reinforced composite plate, and is suitable for with a certain curvature Z reinforced Pin composites.
【技术实现步骤摘要】
一种提高Z-Pin增强的树脂基复合材料成型质量的方法
本专利技术属于树脂基复合材料成型技术,涉及一种提高Z-Pin增强的树脂基复合材料成型质量的方法。
技术介绍
Z-Pin三维增强技术是在不连续缝合技术基础上发展而来的新三维增强技术,其增强机理是在复合材料厚度方向引入Pin针,使材料各层结合在一起,从而提高制件的层间性能和界面连接强度。将Pin针植入未固化的复合材料毛坯后,Pin针与Pin针之间的叠层很容易被Pin针挤压支撑起来,即Z-Pin增强的复合材料毛坯,尤其是Z-Pin增强区域的复合材料毛坯的厚度大于最终复合材料制件的厚度,且随着Pin植入密度的增加,这种现象越专利技术显。后续无论是干态纤维预成型体放置在成型模内装模合模过程,还是预浸料毛坯采用传统均压板传压过程,合模压力或热压罐提供的压力通过成型模或均压板作用在数根Pin针端头后,Pin针均发挥着类似的“架桥”的作用,很难有效传递至Pin针与Pin针之间的叠层,从而导致以下后果:一是Pin针在压力作用下发生歪斜,成型后的复合材料制件表面质量差;二是Pin针与Pin针之间的叠层难以被压实,成型后的复合材料制 ...
【技术保护点】
一种提高Z‑Pin增强的树脂基复合材料成型质量的方法,其特征是,在复合材料毛坯[1]上增加多孔工艺垫板[2],其具体步骤如下:1)按照设计的铺层方案制备复合材料毛坯[1];2)在复合材料毛坯[1]上放置并固定多孔工艺垫板[2],多孔工艺垫板[2]上微孔的行距和列距与待植入Pin针[3]的行距和列距一致;多孔工艺垫板[2]的厚度为0.5mm~5mm,微孔的直径应比Pin针[3]的实际直径大0.1mm~0.3mm,多孔工艺垫板的材料为金属或聚四氟乙烯;3)制备Pin针[3],Pin针[3]的长度=多孔工艺垫板[2]的厚度+复合材料零件[4]的理论厚度;4)将Pin针[3]通过多 ...
【技术特征摘要】
1.一种提高Z-Pin增强的树脂基复合材料成型质量的方法,其特征是,在复合材料毛坯[1]上增加多孔工艺垫板[2],其具体步骤如下:1)按照设计的铺层方案制备复合材料毛坯[1];2)在复合材料毛坯[1]上放置并固定多孔工艺垫板[2],多孔工艺垫板[2]上微孔的行距和列距与待植入Pin针[3]的行距和列距一致;多孔工艺垫板[2]的厚度为0.5mm~5mm,微孔的直径应比Pin针[3]的实际直径大0.1mm~0.3mm,多孔工艺垫板的材料为金属或聚四氟乙烯;3)制备Pin针[3],Pin针[3]的长度=多孔工艺垫板[2]的厚度+复合材料零件[4]的理论厚度;4)将Pin针[3]通过多孔工艺垫板[2]的微孔垂直植入复合材料毛坯[1],得到组合体[5];5)将组合体[5]按复合材料...
【专利技术属性】
技术研发人员:马金瑞,黄峰,刘强,赵龙,
申请(专利权)人:中国航空工业集团公司基础技术研究院,
类型:发明
国别省市:北京,11
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