The invention discloses a solid light emitting device composed of a flip light cell array and a method for manufacturing the same. The invention consists of flip chip light-emitting unit array stereo light emitting devices through P and N complementary LED flip chip connected to replace the LED chip on the metal wiring for each light series parallel between units, makes the process difficulty of LED chip groove metal wiring completely eliminated, greatly improve the production yield, while eliminating the conventional flip the preparation process of silicon substrate. In addition, the invention needs to change the layout design of the LED chip, and can realize the design of different series parallel or mixed combination, the process is relatively simple and flexible, and the production efficiency can be greatly improved.
【技术实现步骤摘要】
【技术保护点】
一种由倒装发光单元阵列组成的立体发光器件,其特征在于:包括第一LED芯片和第二LED芯片,所述第一LED芯片上设置有一个或一个以上相互绝缘的发光单元,每个发光单元分别具有至少一个P电极和至少一个N电极;所述第二LED芯片上设置有一个或一个以上相互绝缘的发光单元,每个发光单元分别具有至少一个P电极和至少一个N电极;所述第一LED芯片倒装在第二LED芯片上,使得第一LED芯片的发光单元与第二LED芯片的发光单元通过串联、并联或串并联的方式完成电连接,实现第一LED芯片与第二LED芯片的共同发光。
【技术特征摘要】
【专利技术属性】
技术研发人员:许玉方,
申请(专利权)人:江苏微浪电子科技有限公司,
类型:发明
国别省市:
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