A polysilicon chip machine spindle, including the bearing sleeve and the main roller shaft, is assembled in the bearing sleeve with two sets of bearings, two bearings are the front bearing group and the rear bearing group, the front bearing group is composed of four bearings, the rear axle bearing group is composed of two bearings, and the bearings of each bearing group are assembled in the bearing bushing and bearing sleeve by the back backrest. The front end is fitted with flanges. The front axle of the front axle bearing front of the front axle bearing group is equipped with a gasket two. The front axle of the front axle bearing group is equipped with an oil retaining ring in front of the outer side of the bearing. The flange is extruded and the gasket two is installed in the front of the bearing sleeve. The inner diaphragm is set between the two groups of bearings, the bearing and the inner septum of the front axle bearing group are at the end of the bearing group. A gasket two is arranged between the rings, and the rear end of the rear axle bearing group is provided with an oil retaining ring two, and the rear two of the oil retaining ring is provided with a flange two, and the flange two is fixed on the rear bearing sleeve. The motorized spindle can improve the ability of bearing axial pressure and reduce the failure rate.
【技术实现步骤摘要】
一种多晶硅切片机主轴
本技术涉及一种多晶硅切片机用主轴,属于机械装备
技术介绍
近年来国内的光伏产业蓬勃发展,急需一款能够高效率、高精度、稳定切割多晶硅的切割设备,而多晶硅切片机主轴是决定设备性能的决定性部件。多晶硅切片机主辊有由两根根主轴配合使用,两根主轴通过一根同心的连接杆连接,连接杆带驱动装置,在两根主轴之间配装主轴主辊,两根主轴对主辊施加20吨的轴向压力使主辊保持位置不变,主辊上缠绕金刚线,主辊数量为三组或四组以上,形成三角形或四边形分布,周围填充砂浆,多晶硅经过粉碎铸锭后的圆柱体或多边体放置于主轴组合多边形的上方,依靠晶体自重和外加压力,压在金刚线上,主轴带动金刚线裹挟大量砂浆完成切割作业,国内外诸多设备中,由于主轴精度、稳定性、刚性的因素,导致设备在切割多晶硅是出现切割速度慢,切割厚度不均,切割片边缘破碎,切割面光洁度差,切割时金刚线断裂等现象,传统多晶硅切片机在设计主轴时主要考虑其轴向所受到的20吨力,没有考虑其径向受力,这是主轴发生故障的原因之一,在多晶硅切片机上由于主轴等原因造成效率低,合格率低,是行业内急需解决的问题之一。
技术实现思路
本技术的目的在于克服目前的多晶硅主轴中存在的上述问题,提供一种多晶硅切片机主轴。为实现本技术的目的,采用了下述的技术方案:一种多晶硅切片机主轴,包括轴承套和主辊轴,在轴承套中组装有两套轴承,所述的两套轴承分别为前轴承组及后轴承组,前轴承组由四个轴承组成,前轴承组的四个轴承采用背靠背组装在轴承套中,后轴承组由两个轴承组成,后轴承组的两个轴承也采用背靠背组装在轴承套中,轴承套的前端安装有法兰一,紧挨前 ...
【技术保护点】
一种多晶硅切片机主轴,包括轴承套和主辊轴,在轴承套中组装有两套轴承,其特征在于:所述的两套轴承分别为前轴承组及后轴承组,前轴承组由四个轴承组成,前轴承组的四个轴承采用背靠背组装在轴承套中,后轴承组由两个轴承组成,后轴承组的两个轴承也采用背靠背组装在轴承套中,轴承套的前端安装有法兰一,紧挨前轴承组最前端的轴承前径向内侧设置有垫片二;紧挨前轴承组最外端的轴承前径向外侧设置有挡油环一,法兰一挤压着垫片二安装在轴承套前部,在两组轴承之间设置有内隔圈,前轴承组最后端的轴承与内隔圈之间设置有垫片二,后轴承组后端设置有挡油环二,挡油环后二安装有法兰二,法兰二固定在后轴承套上。
【技术特征摘要】
1.一种多晶硅切片机主轴,包括轴承套和主辊轴,在轴承套中组装有两套轴承,其特征在于:所述的两套轴承分别为前轴承组及后轴承组,前轴承组由四个轴承组成,前轴承组的四个轴承采用背靠背组装在轴承套中,后轴承组由两个轴承组成,后轴承组的两个轴承也采用背靠背组装在轴承套中,轴承套的前端安装有法兰一,紧挨前轴承组最前端的轴承前径向内侧设置有垫片二;紧挨前轴承组最外端的轴承前径向外侧设置有挡油环...
【专利技术属性】
技术研发人员:胡斌,魏慧斌,张继祝,李晨,黄旭,梁振宇,陈永旺,
申请(专利权)人:安阳斯普机械有限公司,
类型:新型
国别省市:河南,41
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