涂层导体用合金基带的连续电解抛光装置及方法制造方法及图纸

技术编号:6087186 阅读:212 留言:0更新日期:2012-04-11 18:40
本发明专利技术公开了一种涂层导体用合金基带的连续电解抛光装置,该装置包括顺序设置的左右两侧均开有通孔的阳极槽一、电解槽和阳极槽二,以及相配合使用且将待处理的合金基带绷紧后通过所述通孔从阳极槽一、电解槽和阳极槽二内部连续拉过的放带盘和收带盘,还包括通过循环泵分别与阳极槽一、电解槽和阳极槽二相连通的储液箱一、储液箱二和储液箱三。本发明专利技术还公开了采用该装置进行涂层导体用合金基带的连续电解抛光的方法。本发明专利技术的装置结构简单,设计合理,制造成本低,能够实现百米级合金基带的连续电解抛光。采用本发明专利技术的方法进行电解抛光处理,抛光后的合金基带的均方根粗糙度低于5nm。

Continuous electrolytic polishing device and method for alloy base band of coated conductor

The invention discloses a continuous electrolytic polishing device substrate for coating conductor, which comprises a sequence set at the left and right sides are provided with a through hole, the anode and the anode electrolysis slot two, and matched with the alloy substrate to be treated and tightened by the through hole from the anode tank the electrolytic tank and the anode, two internal continuous pull off on the reel and the take-up reel, including through the circulation pump respectively with the anode liquid storage tank, an electrolytic tank and the anode connected to a two-phase liquid storage tank, liquid storage tank three and two. The invention also discloses a method for continuous electrolytic polishing of the alloy base band of the coating conductor by the device. The device has the advantages of simple structure, reasonable design and low manufacturing cost, and can realize the continuous electrolytic polishing of the 100 meter grade alloy base band. The electrolytic polishing process is carried out by using the method of the invention, and the root mean square roughness of the polished alloy base band is lower than 5nm.

【技术实现步骤摘要】

【技术保护点】
1.一种涂层导体用合金基带的连续电解抛光装置,其特征在于,该装置包括顺序设置的左右两侧均开有通孔的阳极槽一(1)、电解槽(2)和阳极槽二(3),以及相配合使用且将待处理的合金基带(4)绷紧后通过所述通孔从阳极槽一(1)、电解槽(2)和阳极槽二(3)内部连续拉过的放带盘(5)和收带盘(6),还包括通过循环泵(10)分别与阳极槽一(1)、电解槽(2)和阳极槽二(3)相连通的储液箱一(7)、储液箱二(8)和储液箱三(9);所述阳极槽一(1)和阳极槽二(3)内前后对称安装有与直流电源相接的阳极板(11),电解槽(2)内前后对称安装有与直流电源相接的阴极板(12);所述收带盘(6)通过与其连接的步进电机驱动合金基带(4)的运行。

【技术特征摘要】

【专利技术属性】
技术研发人员:李成山冀勇斌郑会玲王雪纪平
申请(专利权)人:西北有色金属研究院
类型:发明
国别省市:87

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