The invention relates to an electric spark machining method of a hard small hemisphere pair, and relates to a processing method of a hard small hemisphere pair. In order to solve the problem of rough machining of the hard small hemisphere parts at present, grinding method is adopted, which requires high machine tools, serious abrasion of grinding wheel and long processing time. Design of concave and convex spherical electrode of a first conductive copper bar; and a convex spherical hemisphere workpiece is fixedly connected with a concave spherical electrode two of the first V block is fixedly clamped after immersed in the working liquid, the anode is connected to the power of the hemispherical convex spherical workpiece, the concave spherical electrode is connected to the cathode of a power supply, a convex spherical hemisphere workpiece start exercising, contact with the concave spherical electrode discharge processing, until the convex hemisphere workpiece to the target processing size; processing method of concave spherical hemisphere workpiece with the convex spherical hemisphere workpiece is same, only two pieces of concave spherical hemisphere second V block is fixedly clamped. The invention is applied to the machining of hard small hemisphere pairs on high precision dynamic pressure floating bearings.
【技术实现步骤摘要】
本专利技术涉及一种超硬微小半球偶件的加工方法。
技术介绍
用于动压轴承的微小半球偶件采用一种新型轻质硬质合金材料,它具有极高的硬度(其HRC达到92 93),并且对微小半球偶件的形状精度和尺寸精度要求极高。目前微小半球偶件的粗加工普遍采用的是磨削加工方法,一方面为了保持形状精度,该方法对机床的要求极高(即对工件轴和砂轮轴的回转精度、各轴的导轨直线度要求极高);另一方面砂轮的磨损也比较严重,且加工耗时,给微小半球偶件的推广应用造成了极大的限制。
技术实现思路
本专利技术的目的是提供一种,以解决目前超硬微小半球偶件采用磨削方法进行粗加工存在对机床要求极高、砂轮磨损严重,加工时间长的问题。本专利技术为解决上述技术问题采取的技术方案是一种,所述超硬微小半球偶件包括两个工件,所述两个工件分别是凸球面半球工件和凹球面半球工件,所述超硬微小半球偶件的硬度HRC为92 93 ;所述电火花加工方法由以下步骤完成步骤一设计两个电极;两个电极分别是凹球面电极和凸球面电极;针对凸球面半球工件,设计凹球面电极,凹球面电极的凹球面直径比凸球面半球工件的目标加工直径大40 50 μ m,凹球面 ...
【技术保护点】
1.一种超硬微小半球偶件的电火花加工方法,所述超硬微小半球偶件包括两个工件,所述两个工件分别是凸球面半球工件(1)和凹球面半球工件(2),所述超硬微小半球偶件的硬度HRC为92~93;其特征在于:所述电火花加工方法由以下步骤完成:步骤一:设计两个电极;两个电极分别是凹球面电极(3)和凸球面电极(4);针对凸球面半球工件(1),设计凹球面电极(3),凹球面电极(3)的凹球面直径比凸球面半球工件(1)的目标加工直径大40~50μm,凹球面电极(3)的凹球面误差为10~20μm;针对凹球面半球工件(2),设计凸球面电极(4),凸球面电极(4)的凸球面直径比凹球面半球工件(2)的目 ...
【技术特征摘要】
【专利技术属性】
技术研发人员:赵清亮,谢大纲,房小艳,陈俊云,
申请(专利权)人:哈尔滨工业大学,上海机床厂有限公司,
类型:发明
国别省市:93
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