The utility model discloses a positioning die for shell sealing welding, which relates to the field of electronic packaging technology, and is used to solve the problem that in the process of temperature rise and cooling, the mounting hole of the stainless steel shell is displaced and the lead cannot be concentric with the mounting hole. It includes stainless steel shell and graphite mold. The stainless steel shell is provided with a mounting hole through which a lead is threaded. The upper plane of the graphite mold is provided with a positioning hole corresponding to the location of the mounting hole. The lead is inserted into the positioning hole through the mounting hole. The upper end of the lead is externally covered with a mold sleeve. The bottom surface of the upper mold sleeve is fitted with the upper plane of the stainless steel shell. The inner wall of the upper mold sleeve is fitted with the lead for positioning The hole diameter is larger than the installation hole diameter. In this technical scheme, the die sleeve is set on the outside of the upper end of the lead wire, and the diameter of the positioning hole of the graphite die is larger than the diameter of the installation hole. In the process of temperature rise and cooling, the lead wire can be vertically embedded in the positioning hole of the graphite die and concentric with the installation hole no matter how the installation hole is offset.
【技术实现步骤摘要】
一种封壳焊接用定位模具
本技术涉及电子封装
,具体涉及一种封壳焊接用定位模具。
技术介绍
电子封装就是安装集成电路内置芯片外用的封壳,起着安放固定密封、保护集成电路内置芯片、增强环境适应能力的作用。封壳上设有安装孔,引线安装于安装孔中,引线与安装孔焊接,并且封壳与引线焊接过程中需借助石墨模具进行定位。石墨模具上设有用于引线下端嵌入的定位孔,为保证引线处于竖直状态,定位孔的孔径与引线尺寸较为接近。但是,封壳为不锈钢材料,其与石墨的线膨胀系数存在差异,不锈钢的线膨胀系数较大。焊接时,在高温下,左右两侧的安装孔相对于引线向外移动,导致引线与安装孔焊接偏心,冷却过程中,左右两侧的安装孔相对于石墨模具上的定位孔向内偏移,无法保证引线与封壳安装孔的同心度。
技术实现思路
本技术目的是旨在提供了一种封壳焊接用定位模具,通过在引线上端外部套装上模具套筒,同时设置石墨模具定位孔直径大于安装孔直径,在温度升高及冷却过程中,无论安装孔如何偏移,引线都能竖直嵌入石墨模具定位孔并且与安装孔同心。为实现上述技术目的,本技术采用的技术方案如下:一种封壳焊接用定位模具,包括不锈钢壳体和模具,所述不锈钢壳体上设有安装孔,所述安装孔穿有引线,所述不锈钢壳体下部套入模具上部,所述模具上平面设有与安装孔位置对应的定位孔,所述引线穿过安装孔插入定位孔,所述引线上端外部套装上模具套筒,所述上模具套筒底面与不锈钢壳体上平面贴合,所述上模具套筒内壁与引线贴合,所述定位孔直径大于安装孔直径。采用上述技术方案的技术,包括不 ...
【技术保护点】
1.一种封壳焊接用定位模具,包括不锈钢壳体(1)和石墨模具(2),所述不锈钢壳体(1)上设有安装孔(3),所述不锈钢安装孔(3)穿有引线(4),所述不锈钢壳体(1)下部套入石墨模具(2)上部,所述石墨模具(2)上平面设有与安装孔(3)位置对应的定位孔(5),所述引线(4)穿过安装孔(3)插入定位孔(5),其特征在于,所述引线(4)上端外部套装上模具套筒(6),所述上模具套筒(6)底面与不锈钢壳体(1)上平面贴合,所述上模具套筒(6)内壁与引线(4)贴合,所述定位孔(5)直径大于安装孔(3)直径。/n
【技术特征摘要】
1.一种封壳焊接用定位模具,包括不锈钢壳体(1)和石墨模具(2),所述不锈钢壳体(1)上设有安装孔(3),所述不锈钢安装孔(3)穿有引线(4),所述不锈钢壳体(1)下部套入石墨模具(2)上部,所述石墨模具(2)上平面设有与安装孔(3)位置对应的定位孔(5),所述引线(4)穿过安装孔(3)插入定位孔(5),其特征在于,所述引线(4)上端外部套装上模具套筒(6),所述上模具套筒(6)底面与不锈钢壳体(1)上平面贴合,所述上模具套筒(6)内壁与引线(4)贴合,所述定位孔(5)直径大于安装孔(3)直径。
2.根据权利要求1所述的一种封壳焊接用定位模具,其特征在于:所述上模具套筒...
【专利技术属性】
技术研发人员:阚云辉,郭玉廷,
申请(专利权)人:合肥中航天成电子科技有限公司,苏州中航天成电子科技有限公司,
类型:新型
国别省市:安徽;34
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