The invention discloses a copper strip hardness corrector, which comprises a base, an upper roller mounted above the base and a lower roller mounted on the base. The lower roller is fixed on the base through a lower mounting frame, the upper mounting frame is mounted on the lower mounting frame through a spring column, and the upper pressure roller is mounted on the upper mounting frame. The upper roller and the lower roller are arranged alternately, and a curved copper strip traveling passage is left between them. The spring column has moderate soft and hardness, which ensures that the upper roller and the lower roller are fully pressed and plays the role of correcting the flattening and hardness of the copper strip, and prevents the copper strip from deforming or obviously changing the thickness of the copper strip due to excessive pressure. The invention can correct the deformed or unevenly processed copper strip by pressing without changing the thickness of the copper strip, so that the copper strip becomes flat and has uniform hardness. The invention has the advantages of simple structure, convenient installation and use, easy maintenance, and low manufacturing and using cost.
【技术实现步骤摘要】
铜带硬度校正器
本专利技术涉及铜带加工领域,特别是涉及一种铜带硬度校正器。
技术介绍
铜带是一种金属元件,产品规格有0.1~3×50~250mm各种状态铜带产品,主要用于生产电器元件、灯头、电池帽、钮扣、密封件、接插件,主要用作导电、导热、耐蚀器材。如电气元器件、开关、垫圈、垫片、电真空器件、散热器、导电母材及汽车水箱、散热片、气缸片等各种零部件,在使用时一般需要对铜带进行压平校正处理,现有技术通常采用铜带辊压机对铜带进行压平,但是辊压机的主要是通过多次的碾压使得铜带达到加工所需的厚度,只能生产固定厚度的铜带。因此,需要一种校正器,用于校正因碰撞、移动等原因产生的铜带变形或者因加工粗糙带来的不均匀,使铜带变得平整、硬度均匀。
技术实现思路
本专利技术的目的在于提供一种铜带硬度校正器,用于在不改变铜带厚度的情况下对发生变形或加工不均匀的铜带进行压平校正处理,使其平整、硬度均匀。为了实现上述目的,本专利技术的技术方案为:铜带硬度校正器,包括基座、安装在所述基座上方的上压辊和下压辊,所述下压辊通过下安装架固定安装在所述基座上,所述上安装架通过弹簧柱安装在所述下安装架上,所述上压辊安装在所述上安装架,所述上压辊和下压辊交错排布,之间留有曲线形的铜带行进通道。作为优选,所述上压辊为中间粗两端细的圆柱,两端的细圆柱通过上安装孔安装在所述上安装架上,用于固定上压辊。作为优选,所述下压辊为中间粗两端细的圆柱,两端的细圆柱通过下安装孔安装在所述下安装架上,用于固定下压辊。作为优选,所述上安装孔外侧设有上固定条,用于固定上压辊与上安装架,所述上固定条安装有与所述上压辊中心轴处连接 ...
【技术保护点】
1.铜带硬度校正器,包括基座、安装在所述基座上方的上压辊和下压辊,其特征在于:所述下压辊通过下安装架固定安装在所述基座上,所述上压辊安装在上安装架上,所述上安装架通过弹簧柱安装在所述下安装架上,所述上压辊和下压辊交错排布,之间留有曲线形的铜带行进通道。
【技术特征摘要】
1.铜带硬度校正器,包括基座、安装在所述基座上方的上压辊和下压辊,其特征在于:所述下压辊通过下安装架固定安装在所述基座上,所述上压辊安装在上安装架上,所述上安装架通过弹簧柱安装在所述下安装架上,所述上压辊和下压辊交错排布,之间留有曲线形的铜带行进通道。2.根据权利要求1所述的铜带硬度校正器,其特征在于:所述弹簧柱安装在所述上安装架和下安装架的两端,包括强力弹簧和套接于强力弹簧内的螺钉,所述螺钉穿过上安装架上的圆孔,安装在所述下安装架相对应位置处的螺孔中,所述螺钉顶部螺帽与上安装架上表面之间设有垫片。3.根据权利要求1所述的铜带硬度校正器,其特征在于:所述上压辊为中间粗两端细的圆柱,两端的细圆柱通过上安装孔安装在所述上安装架上。4.根据权利要求1或3所述的铜带硬度校正器,其特征...
【专利技术属性】
技术研发人员:王立秋,陈长军,黄军武,
申请(专利权)人:浙江德通科技有限公司,
类型:发明
国别省市:浙江,33
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