A dispensing method and a circuit board are used to increase the bonding area between the surface mounted components and the circuit board body, thereby improving the reliability of the circuit board. The glue method includes: making the glue hole in the processing area. The processing area refers to the area in the mounting area corresponding to the surface mount components. There is no electronic circuit and the area of the pad. The surface mount components are welded on the circuit board, and the adhesive is injected into the dot glue hole to fill the gap between the surface mount components and the circuit board. Statically placed to wait for viscose curing.
【技术实现步骤摘要】
【国外来华专利技术】PCT国内申请，说明书已公开。
【技术保护点】
PCT国内申请，权利要求书已公开。
【技术特征摘要】
【国外来华专利技术】PCT国内申请，...
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