The utility model provides a BGA anti welding structure for PCB board, including a PCB board, and a number of BGA line units on the PCB board. Each BGA line unit has at least two positioning holes. The BGA line unit includes a number of welding windows, the welding window is equipped with a BGA welding disk, and the diameter of the anti welding window is larger than the diameter 2.1mil of the BGA welding disk. The BGA pad is connected with a pad line, and the BGA line unit also includes a trunk line. The distance between the BGA pad and the adjacent trunk lines is greater than or equal to 3.3mil. The utility model has a reliable positioning hole structure, which can ensure the position of the BGA welding disk, control the distance between the BGA welding disk and the trunk line, and provide the positioning datum for the peripheral printing equipment, effectively prevent the BGA welding pad from being printed on the welding ink; in addition, each BGA line unit has the corresponding setting. The position of the PCB plate is aligned, and the alignment is more detailed and accurate. The BGA pad prevents the performance of the solder resist from being printed.
【技术实现步骤摘要】
一种PCB板的BGA防焊结构
本技术涉及PCB板的结构,具体公开了一种PCB板的BGA防焊结构。
技术介绍
BGA全称是BallGridArry,中文名称是焊球阵列封装,它是在封装体基板的底部制作阵列焊球作为电路的I/O端与PCB板互接,采用该项技术封装的器件是一种表面贴装器件。目前对于线路板的BGA设计是采用防焊开窗的设计,将BGA焊盘裸露处理,再对PCB板进行防焊油墨的印刷,传统的PCB板结构在印刷防焊油墨时容易发生偏移错位,导致BGA焊盘容易被印上防焊油墨,影响后续加工中BGA焊盘与焊球无法顺利焊接,影响PCB板的性能。
技术实现思路
基于此,有必要针对现有技术问题,提供一种PCB板的BGA防焊结构,设置可靠的定位孔结构,能够有效确保印刷防焊油墨的精度,同时增大BGA焊盘与主干线路的间距,防止BGA焊盘被印上防焊油墨。为解决现有技术问题,本技术公开一种PCB板的BGA防焊结构,包括PCB板,PCB板上设有若干个BGA线路单元,每个BGA线路单元外设有至少两个定位孔;BGA线路单元包括若干个防焊开窗,防焊开窗内设有BGA焊盘,防焊开窗的直径大于BGA焊盘的直径2.1m ...
【技术保护点】
一种PCB板的BGA防焊结构,其特征在于,包括PCB板(10),所述PCB板(10)上设有若干个BGA线路单元(20),每个所述BGA线路单元(20)外设有至少两个定位孔(11);所述BGA线路单元(20)包括若干个防焊开窗(21),所述防焊开窗(21)内设有BGA焊盘(22),所述防焊开窗(21)的直径大于所述BGA焊盘(22)的直径2.1mil,所述BGA焊盘(22)连接有焊盘线路(23),所述BGA线路单元(20)还包括若干主干线路(24),所述BGA焊盘(22)与相邻所述主干线路(24)的间距大于等于3.3mil。
【技术特征摘要】
1.一种PCB板的BGA防焊结构,其特征在于,包括PCB板(10),所述PCB板(10)上设有若干个BGA线路单元(20),每个所述BGA线路单元(20)外设有至少两个定位孔(11);所述BGA线路单元(20)包括若干个防焊开窗(21),所述防焊开窗(21)内设有BGA焊盘(22),所述防焊开窗(21)的直径大于所述BGA焊盘(22)的直径2.1mil,所述BGA焊盘(22)连接有焊盘线路(23),所述BGA线路单元(20)还包括若干主干线路(24),所述BGA焊盘(22)与相邻所述主干线...
【专利技术属性】
技术研发人员:龙光泽,
申请(专利权)人:东莞联桥电子有限公司,
类型:新型
国别省市:广东,44
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