The invention discloses a heat conductive and insulating room temperature curable silicone rubber, which includes alpha, _hydroxyl-terminated polydimethylsiloxane as matrix, tetramethoxysilane as crosslinking agent, Al2O3 as main heat conducting filler, AlN and SiC as auxiliary heat conducting filler, ZnO, nano-titanium dioxide, nano-SiO 2 and nano-Al2O3 as anti-settlement additives, and hydroxyl silicone oil with viscosity of 1000 mPa_s is suitable as matrix silicone oil; tetramethoxysiloxane as main heat conducting filler; Alkane is used as crosslinking agent, the suitable amount is 6 phr, tin dibutyldiacetate and diacetylacetone dibutyltin can be used as catalysts, and the appropriate amount of tin dibutyldiacetate is 0.3 wt%. The thermal conductivity of the silicone rubber cured at room temperature was improved to a certain extent due to its excellent anti-settlement properties when the filling content was 8 wt%, 0.8 wt%, 0.8 wt% and 0.5 wt% respectively. The thermal conductivity of the silicone rubber was improved to a certain extent, and the mechanical properties and insulation properties were less affected. The phenyl silicone oil and hydroxyl silicone oil were mixed as matrix silicone oil in a certain proportion to study the thermal resistance of the pure silicone rubber matrix.
【技术实现步骤摘要】
一种导热绝缘室温固化硅橡胶
本专利技术涉及橡胶
,具体为一种导热绝缘室温固化硅橡胶。
技术介绍
随着电子工业的发展,电子元件、集成电路趋于集成化、小型化,对硅橡胶的导热、绝缘性能提出了更高的要求,迫切需要开发出一种导热、绝缘等综合性能优良的硅橡胶材料。
技术实现思路
本专利技术的目的在于提供一种导热绝缘室温固化硅橡胶,以解决上述
技术介绍
中提出的现有的导热绝缘橡胶综合性能不足的问题。为实现上述目的,本专利技术提供如下技术方案,一种导热绝缘室温固化硅橡胶,包括以α,ω-端羟基聚二甲基硅氧烷为基体、四甲氧基硅烷为交联剂,Al2O3为主要导热填料,AlN和SiC为辅助导热填料,ZnO、纳米TiO2、纳米SiO2和纳米Al2O3为防沉降添加剂,粘度1000mPa-s的羟基硅油适宜作为基体硅油;四甲氧基硅烷作为交联剂,合适用量为6份;二丁基二乙酸锡和双乙酰丙酮基二丁基锡均可作为催化剂,合适的二丁基二乙酸锡用量为0.3wt%。优选的,所述α,ω-端羟基聚二甲基硅氧烷为基体。优选的,所述阻燃层使用的材质为聚酯纤维。优选的,所述ZnO、纳米TiO2、纳米SiO2和纳米Al2O3为 ...
【技术保护点】
1.一种导热绝缘室温固化硅橡胶,包括以α,ω‑端羟基聚二甲基硅氧烷为基体、四甲氧基硅烷为交联剂、Al2O3为主要导热填料,AlN和SiC为辅助导热填料,ZnO、纳米TiO2、纳米SiO2和纳米Al2O3为防沉降添加剂,粘度1000mPa‑s的羟基硅油适宜作为基体硅油;四甲氧基硅烷作为交联剂,合适用量为6份;二丁基二乙酸锡和双乙酰丙酮基二丁基锡均可作为催化剂,合适的二丁基二乙酸锡用量为0.3 wt%。
【技术特征摘要】
1.一种导热绝缘室温固化硅橡胶,包括以α,ω-端羟基聚二甲基硅氧烷为基体、四甲氧基硅烷为交联剂、Al2O3为主要导热填料,AlN和SiC为辅助导热填料,ZnO、纳米TiO2、纳米SiO2和纳米Al2O3为防沉降添加剂,粘度1000mPa-s的羟基硅油适宜作为基体硅油;四甲氧基硅烷作为交联剂,合适用量为6份;二丁基二乙...
【专利技术属性】
技术研发人员:詹浩,
申请(专利权)人:中绿新材料江苏有限公司,
类型:发明
国别省市:江苏,32
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