The invention relates to a cutting device and a cutting manufacturing process, which can be used for cutting a workpiece. The cutting device has a processing light source, a light modulating element, a focusing mirror group and an integral mirror set. A light beam is output by the processing light source, and the light modulating element receives the beam, and can output at least one of the first sub beam and the second sub beam. The first sub beam and the second sub beam respectively reach the workpiece along the first light path and the second light path. The focusing mirror group is positioned on the first light path and can be used for focusing the first sub beam. The integral mirror set is located on the second light path, which can be used to transform the second child beams into all cut beams, and the shape of the first sub beam is essentially different from the shape of the cut beam. The cutting process involves forming a first crack at the edge of the workpiece by focusing the first sub beam, then starting with the starting crack and cutting the workpiece by cutting the beam.
【技术实现步骤摘要】
【技术保护点】
一种切割设备，适于切割一工件，其特征在于，所述的切割设备包括：一加工光源，用以输出一光束；一光调变元件，用以接收所述的光束，并可输出一第一子光束与一第二子光束至少其中之一，其中所述的第一子光束与所述的第二子光束分别沿一第一光路与一第二光路到达所述的工件；一聚焦镜组，位于所述的第一光路上，用以聚焦所述的第一子光束；以及一整型镜组，位于所述的第二光路上，用以将所述的第二子光束整型为一切割光束，且所述的第一子光束的形状与所述的切割光束的形状实质上不同。
【技术特征摘要】
【专利技术属性】
技术研发人员：叶丽雅，王书志，朱智伟，谢文章，
申请(专利权)人：友达光电股份有限公司，
类型：发明
国别省市：71[中国|台湾]
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