The invention provides a radiating device of Ethernet SFP port module, which comprises a first metal shell, second metal shell, and the printed circuit is disposed between the first metal shell and the second shell of the metal plate, the printed circuit board is provided with a first heat source unit; the heat radiating device also comprises a first heat insulator, the the first heat insulator, respectively in contact with the first heat source unit and the first metal shell and the first heat insulator at the first heat source unit and the first metal enclosure. The beneficial effect of the invention is the first metal shell and the first heat insulator can heat the first heat source unit out, forming a heat conductive channel, to ensure the normal operation of the SFP port module in high temperature environment.
【技术实现步骤摘要】
【技术保护点】
１．一种以太网ＳＦＰ电口模块的散热装置，其特征在于：包括第一金属外壳、第二金属外壳、以及位于所述第一金属外壳和所述第二金属外壳之间的印刷线路板，所述印刷线路板上设有第一热源单元；该散热装置还包括第一导热绝缘体，所述第一导热绝缘体分别与所述第一热源单元和所述第一金属外壳接触、且所述第一导热绝缘体位于所述第一热源单元和所述第一金属外壳之间。
【技术特征摘要】
【专利技术属性】
技术研发人员：廉顺存，曹堪忠，
申请(专利权)人：深圳市恒宝通光电子有限公司，
类型：发明
国别省市：94
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