电解铜箔制造技术

技术编号:8936751 阅读:187 留言:0更新日期:2013-07-18 06:10
一种电解铜箔,其为表面粗糙度Rz为2.0μm以下的电解铜箔,其特征在于,宽度方向的箔厚差为1.5%以下。宽度方向的箔厚差为1.3%以下。所述电解铜箔的特征在于,宽度方向的粗糙度的偏差(Rzmax-Rzmin)/Rzavg为15%以下。本发明专利技术的课题在于得到一种电解铜箔,其为表面粗糙度小的电解铜箔,通过使宽度方向和长度方向的厚度均匀而抑制形成“伸长褶皱”或沿长度方向变色的条纹。

Electrolytic copper foil

The utility model relates to an electrolytic copper foil, which is an electrolytic copper foil with a surface roughness of 2 m and below Rz, and is characterized in that the foil thickness difference of the width direction is below 1.5%. The foil thickness difference in width direction is below 1.3%. The electrolytic copper foil is characterized in that the deviation of the roughness of the width direction (Rzmax-Rzmin) is below 15% /Rzavg. The subject of the invention is to obtain an electrolytic copper foil, its surface roughness of the electrolytic copper foil, the width direction and the direction of the length of uniform thickness and inhibit the formation of the \elongated fold\ or discoloration along the length direction of the stripe.

【技术实现步骤摘要】
【国外来华专利技术】

【技术保护点】

【技术特征摘要】
【国外来华专利技术】...

【专利技术属性】
技术研发人员:古曳伦也
申请(专利权)人:吉坤日矿日石金属株式会社
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