芯片封装结构及方法、电子设备技术

一种芯片封装结构及方法、电子设备。芯片封装结构包括：支撑体、芯片(2)、至少一导电体以及用于塑封支撑体、芯片、导电体的塑封体(4)；芯片设置于支撑体的上表面，芯片的上表面(21)形成有芯片焊盘(22)，且芯片焊盘通过打线连接至支撑体的外部焊盘(12)；导电体连接于外部焊盘或芯片焊盘中的接地焊盘，且导电体至塑封体的上表面(41)的最短距离小于打线至塑封体的上表面的最短距离。在基本不增加芯片封装的成本基础上，大幅减少静电释放导致的芯片失效问题。

Chip Packaging Structure, Method and Electronic Equipment

The invention relates to a chip encapsulation structure, a method and an electronic device. The chip package structure includes: a support, a chip (2), at least one conductive body and a plastic package (4) for plastic packaging support, chip and conductive body; the chip is arranged on the upper surface of the support body, and the chip upper surface (21) forms a chip pad (22), and the chip pad is connected to the external pad (12) of the support body by wire bonding; the conductive body is connected to the grounding of the external pad or chip pad. The shortest distance from the conductor to the upper surface (41) of the plastic seal body is less than the shortest distance from the wire to the upper surface of the plastic seal body. On the basis of not increasing the cost of chip packaging, the problem of chip failure caused by electrostatic discharge is greatly reduced.

【技术实现步骤摘要】
【国外来华专利技术】PCT国内申请，说明书已公开。

【技术保护点】
PCT国内申请，权利要求书已公开。

【技术特征摘要】
【国外来华专利技术】PCT国内申请，...

【专利技术属性】
技术研发人员：吴宝全，喻新飞，
申请(专利权)人：深圳市汇顶科技股份有限公司，
类型：发明
国别省市：广东,44