The invention relates to a composite base copper clad board and a preparation method thereof. The composite base copper clad board comprises a core layer and a fabric layer. The upper and lower surfaces of the core layer are provided with a fabric layer, the core layer is at least a wood pulp paper or cotton pulp paper impregnated resin bonding sheet, the fabric layer is at least a glass fibre paper impregnated resin bonding sheet, and the copper foil layer is arranged on the fabric layer. The preparation method comprises the following steps: (1) the resin glue of glass fiber paper impregnated fabric is made into fabric bonding sheet, and the fabric bonding sheet is superimposed as the upper material layer or the lower material layer; (2) the resin glue of wood pulp paper or cotton pulp paper impregnated core material is made into core material bonding sheet, and the core material bonding sheet is superimposed as the core material layer; (3) the following material layer, the core material layer, the upper material layer and the copper foil layer are superimposed. Put it all together and press it together. The invention adopts fiberglass paper instead of glass cloth as fabric, and uses new resin formula to press, each performance index is superior to that of the current similar products, and has the characteristics of low cost and high performance-price ratio.
【技术实现步骤摘要】
一种复合基覆铜板及其制备方法
本专利技术涉及一种用于起支撑元器件和导电作用的复合基覆铜板及其制备方法,属于覆铜板
技术介绍
复合基覆铜板是将增强材料浸以树脂制成半固化片,一面或两面覆以铜箔经热压而成的一种板状材料,是做PCB(印制电路板)的基本重要材料,主要起互连导通、绝缘和支撑的作用。主要用于各种家电、显示器、汽车电子等智能化信息产品。复合基覆铜板的制造工艺如下所述:1.树脂合成:将环氧树脂、酚醛树脂、固化剂、阻燃剂、填料、溶剂等按一定比例配合成一定固含量、粘度和凝胶时间的树脂。2.浸渍与干燥:用玻璃布、玻纤纸和木浆纸做增强材料,浸渍以合成树脂(胶粘剂),经烘干,制成一定固化程度的粘结片(简称PP)。3.热压成型:根据不同产品厚度,将一定数量PP叠配,单面或双面覆以铜箔,配以不锈钢模板等,经热压而成单面或双面覆铜板。单纯用若干PP,不用铜箔,热压而成,称为绝缘板。复合基覆铜板生产所用的增强材料有:1.玻璃布:一般采用平纹E-玻纤布,含碱量小于0.8%,克重一般在100-220g/m2之间;2.玻纤纸(也称无纺布、玻璃毡):一般采用50-105g/m2的无碱毡;3.漂白棉纤维纸或漂白木纤维纸:通常用120-140g/m2克重的纸。目前复合基覆铜板的构成主要有两种:1.是CEM-3,两面各用一张玻璃布浸树脂做面料,中间用若干张玻纤纸(又称玻璃毡、无纺布)浸树脂做芯料,单面或双面覆铜箔;2.是CEM-1,两面各用一张玻璃布浸树脂做面料,中间用若干张木浆纸浸树脂做芯料,单面或双面覆铜箔;由上述复合基覆铜板的构成可以看出,其两面都是各用一张玻璃布浸树脂做 ...
【技术保护点】
1.一种复合基覆铜板,包括芯料层和面料层,芯料层的上下面均设置面料层,其特征是:所述芯料层至少为一张木浆纸浸树脂粘结片,所述面料层至少为一张玻纤纸浸渍树脂粘结片,所述面料层上设置铜箔层。
【技术特征摘要】
1.一种复合基覆铜板,包括芯料层和面料层,芯料层的上下面均设置面料层,其特征是:所述芯料层至少为一张木浆纸浸树脂粘结片,所述面料层至少为一张玻纤纸浸渍树脂粘结片,所述面料层上设置铜箔层。2.根据权利要求1所述复合基覆铜板,其特征是:该复合基覆铜板的厚度为0.4mm-10mm。3.根据权利要求1所述复合基覆铜板,其特征是:所述玻纤纸的克重为50-150g/m2。4.根据权利要求1所述复合基覆铜板,其特征是:所述木浆纸或棉浆纸的克重为100-150g/m2。5.一种权利要求1-4所述复合基覆铜板的制备方法,其特征是,包括以下步骤:(1)将克重为50-150g/m2的玻纤纸浸渍面料树脂胶液,含胶量为45-50%,160℃-185℃烘干制成面料粘结片,将1张以上的面料粘结片叠加在一起作为上面料层或下面料层;所述环氧树脂胶液是含卤面料树脂胶液或无卤面料树脂胶液;(2)将克重为100-150g/m2的木浆纸或棉浆纸浸渍芯料树脂胶液,含胶量50-60%,165℃-175℃烘干制成芯料粘结片,将1张以上的芯料粘结片叠加在一起作为芯料层;所述芯料树脂胶液是含卤芯料树脂胶液或无卤芯料树脂胶液;(3)将下...
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