The invention relates to a high reflection LED encapsulation bracket, comprising a board, an insulating dam and a metal lead frame, which is characterized in that the metal lead frame is arranged in the base plate, the insulating dam is surrounded by a concave groove on the upper surface of the base plate, the cross section shape of the insulating dam is a right trapezoid, and the inclined side is arranged in the inner side of the dam; and the ring is arranged in the concave groove. The ring-shaped convex island is located on the substrate, and the surrounding area of the ring-shaped convex island on the substrate is the LED wafer installation area; the area of the LED wafer installation area is smaller than the area at the bottom of the concave groove, and the ring-shaped convex island is filled with high-reflective white glue between the ring-shaped convex island and the insulation dam; the convex island is formed by a mould once to realize secondary spraying of high-reflective glue or dispensing process to increase the angle of the reflector cup Now a new package is coated with high reflectivity white glue on the package bracket, and the reflection angle is increased to improve the reflectivity of light, so as to improve the efficiency of light extraction.
【技术实现步骤摘要】
一种高反射LED封装支架
本专利技术涉及LED封装
,特别是一种高反射LED封装支架。技术背景如图1所示,现有的QFN形式的LED封装支架由金属引线框架和绝缘围坝构成;其中金属引线框架由基材金属和镀层金属组成,总厚度在0.10mm~0.35mm,绝缘围坝由热固型和热塑型树脂填充料形成的碗杯高度由芯片厚度和封装工艺决定;两者构成的支架为后续LED封装提供载体,散热导电通道和保护等;但这类封装支架已无法有效提升光取出效率。
技术实现思路
为解决上述问题,本专利技术的目的是提供一种高反射LED封装支架,提高封装支架光的反射率。本专利技术实施例中采用以下方案实现:提供一种高反射LED封装支架,包括基板、绝缘围坝、金属引线框架,所述的金属引线框架设置在所述基板内,所述绝缘围坝在所述基板的上表面围成凹形槽,所述绝缘围坝的截面形状为直角梯形,所述直角梯形的斜边在所述围坝的内侧;在所述凹形槽内设置有环形凸岛位于所述基板上,环形凸岛在所述基板上的围绕区域为LED晶片安装区;所述LED晶片安装区的面积小于所述凹形槽底部的面积,在所述环形凸岛和所述绝缘围坝之间填充高反射白胶。本专利技术一实施例中,所述高反射白胶的填充区域为所述基板、所述围坝的斜面、所述凸岛和所述凸岛顶部与所述斜边顶部之间的连线组成的封闭区域。本专利技术一实施例中,在所述基板内位于所述环形凸岛一侧边的下侧设置有绝缘隔条将所述金属引线框架分隔成两部分,以利于隔开金属引线框架的正负极。本专利技术一实施例中,所述高反射白胶的斜面底端与所述凸岛的顶点重合。本专利技术一实施例中,所述高反射白胶填充后形成的斜面与所述凸 ...
【技术保护点】
1.一种高反射LED封装支架,包括基板、绝缘围坝、金属引线框架,其特征在于:所述的金属引线框架设置在所述基板内,所述绝缘围坝在所述基板的上表面围成凹形槽,所述绝缘围坝的截面形状为直角梯形,所述直角梯形的斜边在所述围坝的内侧;在所述凹形槽内设置有环形凸岛位于所述基板上,环形凸岛在所述基板上的围绕区域为LED晶片安装区;所述LED晶片安装区的面积小于所述凹形槽底部的面积,在所述环形凸岛和所述绝缘围坝之间填充高反射白胶。
【技术特征摘要】
1.一种高反射LED封装支架,包括基板、绝缘围坝、金属引线框架,其特征在于:所述的金属引线框架设置在所述基板内,所述绝缘围坝在所述基板的上表面围成凹形槽,所述绝缘围坝的截面形状为直角梯形,所述直角梯形的斜边在所述围坝的内侧;在所述凹形槽内设置有环形凸岛位于所述基板上,环形凸岛在所述基板上的围绕区域为LED晶片安装区;所述LED晶片安装区的面积小于所述凹形槽底部的面积,在所述环形凸岛和所述绝缘围坝之间填充高反射白胶。2.根据权利要求1所述的一种高反射LED封装支架,其特征在于:所述高反射白胶的填充区域为所述基板、所述围坝的斜面、所述环形凸岛和所述环形凸岛顶部与所述斜边顶部之间的连线组成的封闭区域。3.根据权利要求1所述的一种高反射LED封装支架,其特征在于:在所述基板内位于所述环形凸岛...
【专利技术属性】
技术研发人员:林紘洋,张智鸿,袁瑞鸿,万喜红,雷玉厚,李昇哲,
申请(专利权)人:福建天电光电有限公司,
类型:发明
国别省市:福建,35
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