A chip positioning fixture combination for high-power devices consists of a special positioning fixture and a pressing block, the positioning fixture is a round block, and the part of the clamp is arranged with two positioning cavities; the four angles of the positioning cavity are respectively opened with circular arcs; the shape of the block is a column shape consistent with the shape of the chip, and the end face size is the same as the chip size. The thickness of the positioning fixture is higher than the chip and is lower than the 2/3 of the chip and the total thickness of the block. The size of the positioning frame is designed according to the shape and size of the large power device shell, the substrate. The positioning fixture is made of stainless steel and pressed with aluminum or stainless steel. The utility model has the advantages of simple production process, accurate positioning, effective fixation of chip and press block, no migration of the chip, no pollution, and better wetting and spreading of the substrate and the shell, and the improvement of product quality and work efficiency. The positioning fixture assembly can be made according to the size of different housings and chips, and is suitable for assembly of high-power device packaging products.
【技术实现步骤摘要】
一种适用于大功率器件的芯片定位夹具组合
本技术涉及制造半导体器件的方法,具体来说,涉及制造过程中大功率器件的芯片定位夹具组合。
技术介绍
在半导体行业中,真空烧结工艺里芯片的摆放一种方法是靠人工操作熟练度来摆放,没有任何固定芯片措施。这不仅影响到芯片烧结一致性,而且不同操作人员装结芯片会产生偏移误差,真空烧结过程中充入氮气、芯片压块掉落,也会导致芯片偏移,而芯片稍微偏移就会造成产品短路或者过热烧坏。另一种方法是利用石墨材质的芯片定位夹具来固定住芯片,由于石墨材质易碎,操作不规范容易致使夹具裂开;在芯片烧结完成后取出夹具时,石墨粉尘容易沾污芯片。这样就需要设计一款非石墨材质的芯片定位夹具,不仅要固定芯片使芯片不会偏移,还要保证利于压块摆放、芯片不会被夹具损坏及沾污。中国专利数据库中,涉及芯片定位夹具的专利申请件近年来大量增加,例如ZL2006200225294号《焦平面探测器芯片的专用粘接固定夹具》、ZL2011202829904号《一种手动式芯片测试夹具》、ZL2012201416792号《一种PLC分路器封装用芯片定位夹具》、ZL2013205972458号《柱状电容陶瓷芯片与金属件焊合夹具》、ZL201410542634X号《一种芯片储运治具用定位件夹具》、2015103481474号《真空共晶焊的芯片定位夹具、制造方法及芯片转运方法》、2016203873682号《一种半导体激光器芯片的自对准烧结夹具》等,但涉及芯片定位的专利申请件尚不能解决大功率器件的芯片定位问题。
技术实现思路
本技术旨在提供一种适用于大功率器件的芯片定位夹具组合,以克服现有技术的缺 ...
【技术保护点】
1.一种适用于大功率器件的芯片定位夹具组合,其特征在于它包含专用定位夹具(6)和压块(5),定位夹具(6)为圆块状,其中部并列排布两个定位腔(8);定位腔(8)的四角分别开有圆弧(7);压块(5)形状为端面与芯片(4)形状一致的立柱形,端面尺寸与芯片(4)尺寸一致。
【技术特征摘要】
1.一种适用于大功率器件的芯片定位夹具组合,其特征在于它包含专用定位夹具(6)和压块(5),定位夹具(6)为圆块状,其中部并列排布两个定位腔(8);定位腔(8)的四角分别开有圆弧(7);压块(5)形状为端面与芯片(4)形状一致的立柱形,端面尺寸与芯片(4)尺寸一致。2.按照权利要求1所述的定位夹具组合,其特征在于所述定位夹具(6)...
【专利技术属性】
技术研发人员:谌帅业,胡锐,尹国平,刘俊,卢辉昊,周恒,薛山,朱正永,刘孝梅,李洪秀,商登辉,田东,
申请(专利权)人:贵州振华风光半导体有限公司,
类型:新型
国别省市:贵州,52
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